ASE Technology Holding Co., Ltd. Is Betting on Panel-Level Packaging—How This Could Reshape Advanced Packaging Scale!

Advanced Semiconductor Engineering, Inc. (ASE), a major player in semiconductor devices and packaging, highlighted several evolving prospects and challenges during its latest earnings call. The company’s performance was presented with optimism due to innovations in advanced packaging aimed at bolstering its support for cloud and AI technologies. ASE’s Executive VP of Sales and Marketing, Yin Chang, elaborated on the current boom in AI application, suggesting it will lead to a 25-fold increase in the AI economy from 2023 to 2033. This growth is primarily fueled by consumer-generated data utilized by AI for advancing various applications. ASE confidently aligned itself with the ongoing rise in AI by improving its systems to accommodate increased demands in compute, networking, memory, and power related to AI semiconductor technology. On the positive side, ASE’s efforts to keep pace with escalating AI needs were emphasized.