Applied Materials, Inc.: Advanced Packaging and High-bandwidth Memory (HBM) Growth

Applied Materials has delivered strong performance in the second quarter of 2024, and is well positioned to benefit from long-term secular growth trends. Key technology innovations reshaping the global economy such as artificial intelligence (AI), internet of things (IoT), and electric and autonomous vehicles are underpinned by semiconductors, potentially driving demand for more chip manufacturing capacity and fostering superior chips with improved energy efficiency. Notably, significant inflections, key to the semiconductor roadmap, are facilitated by Applied Materials and are likely to promote its outperformance as next-generation chip technologies advance into large-scale production. The complexity in the implementation of the industry’s roadmap and the introduction of new semiconductor technologies to the market are resulting in closer collaboration with customers in the early stages and broadening the growth scope for the company’s service business.