Description
Taiwan Semiconductor delivered a positive result and managed an all-around beat in the last quarter, with significant revenue growth and a focus on strategic planning for the future. During the quarter, the company experienced a sequential increase of 13.7% in revenue in NT dollars or 10.2% in US dollars. This boost was fueled by the robust adoption of the company’s industry-leading 3-nanometer technology and increasing demand for 5-nanometer technologies, although partially offset by ongoing customer inventory adjustments. Revenue contributions by platform indicated that HPC, smartphones, IoT, automotive, and DCE accounted for 42%, 39%, 9%, 5%, and 2% of third-quarter revenue, respectively. Looking ahead, Taiwan Semiconductor’s team anticipates strong performance in the fourth quarter, with revenue expected to range between USD 18.8 billion and USD 19.6 billion, representing an 11.1% sequential increase at the midpoint. Despite near-term market fluctuations, they remain steadfast in supporting customer growth and investing in advanced technologies to drive growth and deliver value to shareholders. In the quarter, Taiwan Semiconductor unveiled the 3Dblox 2.0 open standard and highlighted significant accomplishments of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0 incorporates advanced 3D IC design functionality to enhance design efficiency.
Our Report Structure:
⦁ Company Overview
⦁ Investment Thesis
⦁ Key Drivers
⦁ Historical Quarterly Statement Analysis – Income Statement & Cash Flows
⦁ Historical Quarterly Balance Sheet Analysis
⦁ Historical Annual Financial Statement Analysis
⦁ Analysis Of Key Financial Ratios
⦁ Financial Forecasts For 3 Years
⦁ Forecasting The Capital Structure & Net Debt
⦁ Discounted Cash Flow Valuation
⦁ Trading Multiples
⦁ Key Risks
⦁ Disclosures
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